Microvias : for low-cost, high-density interconnects
By: Lau, John H.
Contributor(s): Lee, S.W. Ricky.
Material type:
BookPublisher: [S.l.] : McGraw-Hill Professional, 2001Edition: 1st ed.Description: 565 p.ISBN: 0071363270 (hardcover); 9780071363273 (hardcover).Subject(s): Printed circuits | Microelectronic packaging | Semiconductors--Junctions | Integrated circuits--Design and construction--Cost control | Microelectronics--Materials | Solder and soldering | Solder and soldering--Testing | Micro-drilling Online resources: Click here to access online
| Item type | Current location | Collection | Call number | Status | Date due | Barcode | Item holds |
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Books
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Reference Section | Reference | 621.3815LEU (Shelf - 54E) (Browse shelf) | Available | 46282 |
Total holds: 0
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